Today I put together the first 17 OpenSynth Kits. This took a LONG time, part of which was figuring out how to do things. For the next batch I’m going to be recruiting some help, there are lots of tasks that can be done in parallel…
First task is to lay out all the parts.
Next I started by organizing all the passive, non-ESD sensitive parts such as capacitors and resistors. These are placed onto a piece of card stock with double sided tape, and then covered with self-laminating sheet material.
Next up was the mechanical parts – connectors, wire, and the heat sink. The wires were cut to length, heat sink adhesive cut and applied (it comes in a large double-sticky sheet) to the heat sinks. Parts were then placed into ESD bags, sealed and tagged.
The next step was to program the microcontrollers and put all the ESD sensitive parts into small plastic foam-lined ESD safe boxes.
Finally it is time to seal up the bags! Some of the parts (the LEDs and microcontrollers are humidity sensitive, so this step included adding dessicant packs and humidity indicator cards to the special humidity resistant bags before themal sealing.
Well that is about it! After this, both the passive component card and ESD parts bags will be put into padded mailing envelopes and headed out the door!